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Shattering the ‘copper or optics’ paradigm: humble plastic could become key material in race to conquer AI data center market – it is cheaper, lighter, thinner and more power efficient

With the expansion of data centers and the rise of generative AI, LLMs, IoT and video streaming services, the demand for advanced interconnects is higher than ever.

Conventional interconnects using copper have critical bandwidth limitations caused by the ‘skin effect’, where the current flowing through the cable is concentrated at the surface of the conductor. Optical interconnects, while offering high capacity over longer distances, require significant capital expenses for short-reach, high-volume links deployment.

Source: www.techradar.com

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