Redmi Turbo 4 Launch
Redmi showed in a Weibo post that its upcoming Turbo 4 handset, which is about to release in early 2025, shall be powered through a MediaTek Dimensity 8400-Ultra SoC. It is said to be the primary telephone to get that chipset.
Previous leaks have claimed that the Redmi Turbo 4 will most probably arrive in China through January 2025. A leaked design render of the approaching smartphone suggests it’s going to have a twin rear digicam setup and a flat show with uniform, very narrow bezels.
Realme Neo 7 SE Teased
Realme, then again, teased the release of a brand new smartphone with the MediaTek Dimensity 8400 SoC, which was once not too long ago unveiled. The corporate didn’t divulge the identify of the approaching handset. Tipster Digital Chat Station (translated from Chinese) suggested that this might be the Realme Neo 7 SE.
The MediaTek Dimensity 8400 chipset sits above the Dimensity 8300 and is derived with 8 Arm Cortex-A725 cores, the place a number one core clocks at 4.32GHz. It is paired with the Arm Mali-G720 GPU and is alleged to make stronger as much as LPDDR5x RAM and UFS 4.0 onboard garage. The processor features a MediaTek NPU 880, which is helping it carry out generative AI duties.
The newest MediaTek chipset additionally has an in-built MediaTek Imagiq 1080 ISP which is said to lend a hand seize extra gentle and center of attention sooner. Smartphones with this SoC are stated to make stronger as much as 320-megapixel digicam sensors and presentations with as much as WQHD answer with as much as 144Hz refresh charge.
Source: www.shamnadt.com.com